Monday, May 21, 2012

IPhone 5 problems – The A5 dual core processor is overheating!

Benefiting from a complex layering system so as to avoid overheating issues, Apple’s A6 processor could beat Intel for 3D IC chip construction. Supposedly, the next-gen iPhone and the current Apple A5 processor are being threatened by a delay due to some overheating issues. Is a delay of Apple’s long awaited new phone in store?
IPhone 5
IPhone 5
While information about iPhone 6 and its CPU are starting to take shape, it seems that the iPhone 5 has problems with overheating. If the dual core Apple A5 processor worked smoothly on the iPad 2, the next iPhone will have the same CPU adapted to a smaller chassis, due to its problems with temperature.  The Chinese website Sohu states that Apple has problems with the A5chipset, indicating the possibility of postponing the new model until the problems are solved. Meanwhile, the Cupertino giant may launch the iPhone 4S, to somewhat make up for the delay of the next generation smartphone and offering only a modest upgrade to the Phone 4.
Regarding the iPhone 6 and the A6 processor, the TSMC is the favorite company to work with Apple on this matter. It seems that the Asian company has already produced the first chip samples and the iPhone’s manufacturer analyzes its performance and offer. So how does the future looks for Apple? Apple’s future plans include, among others, abandoning Samsung as a partner, following the recent conflicts and Samsung’s growth as a smartphone and tablet provider, and abandoning Intel in regard to the processing solutions on the MacBook. Their chips will be replaced with ARM chips and the design of Apple’s A6 CPU could be a 3D one from TSMC… Sample production of the A6 is believed to already have begun.
What is your opinion on the subject matter? Would you be satisfied with the iPhone 4 S?

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